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Plasma Etching Equipment Product List and Ranking from 6 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Sep 02, 2026~Sep 29, 2026
This ranking is based on the number of page views on our site.

Plasma Etching Equipment Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 02, 2026~Sep 29, 2026
This ranking is based on the number of page views on our site.

  1. 神港精機 東京支店 Tokyo//Industrial Machinery
  2. プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
  3. ナラサキ産業 メカトロソリューション部 機能材料課 Tokyo//Manufacturing and processing contract
  4. 4 片桐エンジニアリング Kanagawa//Other manufacturing
  5. 4 三友製作所 テクノセンタ Ibaraki//Industrial Machinery

Plasma Etching Equipment Product ranking

Last Updated: Aggregation Period:Sep 02, 2026~Sep 29, 2026
This ranking is based on the number of page views on our site.

  1. High-Density Radical Cleaning Solution プラズマ・サーモ・ジャパン
  2. Tabletop Plasma Etching Device 'TP-50B' ナラサキ産業 メカトロソリューション部 機能材料課
  3. CCP plasma etching device 'CCP-T60M/B2M' 片桐エンジニアリング
  4. Single-wafer plasma etching device "EXAM-Σ" 神港精機 東京支店
  5. Plasma etching device "EXAM" sample testing now accepting applications. 神港精機 東京支店

Plasma Etching Equipment Product List

1~13 item / All 13 items

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Tabletop Plasma Etching Device 'TP-50B'

Tabletop plasma etching device capable of localized processing with unique spot plasma technology.

The "TP-50B" is a 50W model that does not require installation permission applications under the Radio Law, and it is an easy-to-operate tabletop plasma etching device that allows for casual plasma processing. With its unique spot plasma technology, it enables localized processing and can handle a wide range of plasma processing from pre-treatment of semiconductor failure analysis samples (exposing wiring) to various plasma applications. Additionally, its compact size makes it suitable for use in research labs with limited space. 【Features】 ■ Compact tabletop size ■ Capable of localized plasma processing (Φ0.5mm and above) ■ Achieves low residue and high-speed processing (10μm/min) ■ Low-output RF power supply (maximum output of less than 50W) ■ Allows for extensive processing by moving the sample on the stage *For more details, please download the PDF or feel free to contact us.

  • Plasma surface treatment equipment
  • Plasma Etching Equipment

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ICP plasma etching device "SERIO"

Achieve smooth etching surfaces and high machining precision! We support sample testing!

"SERIO" is a high-density plasma etching device that accommodates a wide range of applications, including deep silicon etching, vertical processing of quartz, and organic film etching. Equipped with a proven ICP plasma electrode, it achieves smooth etching surfaces and high processing precision. It enables smooth etching without scalloping, making it suitable for creating nanoimprint molds. It possesses many process capabilities required for nanoimprint molds, such as smooth etching sidewalls, verticality of the processing surface, and control of opening angles. 【Features】 ■ Smooth etching sidewalls without scalloping ■ High verticality during deep silicon etching (90°±2°) ■ Controllability of etching taper angles ■ Support for high aspect ratio etching ■ Permanent demonstration unit available ■ Sample testing available *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment
  • Plasma Etching Equipment

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Plasma etching device "EXAM" sample testing now accepting applications.

A compact batch-type plasma etching device that supports sub-micron etching and features process support through sample testing.

Supports etching of submicron Si oxide films in batch type. Compatible not only with SiN and Si-based thin films but also with high melting point metals and difficult-to-etch materials. Ideal for processing niche devices such as vertical etching of quartz and fine processing of thick photoresist. Actively supports a wide range of applications from ashing to cleaning through a multi-step process enabled by plasma mode switching.

  • Etching Equipment
  • Other physicochemical equipment
  • Plasma Generator
  • Plasma Etching Equipment

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Tabletop Plasma Etching Device 'TP-50B'

Tabletop plasma etching device capable of localized processing with unique spot plasma technology.

The "TP-50B" is a 50W model that does not require installation permission applications under the Radio Law, and it is easy to operate, making it a tabletop plasma etching device that allows for casual plasma processing. With its unique spot plasma technology, it enables localized processing and can handle a wide range of plasma processing, from pre-treatment (exposing wiring) for semiconductor failure analysis samples to various plasma applications. Additionally, its compact size makes it suitable for research laboratories with limited space. 【Features】 ■ Compact tabletop size ■ Capable of localized plasma processing (Φ0.5mm and above) ■ Achieves low residue and high-speed processing (10μm/min) ■ Low output RF power supply (maximum output under 50W) ■ Allows for extensive processing by moving samples on a stage *For more details, please download the PDF or feel free to contact us.

  • Etching Equipment
  • Other semiconductor manufacturing equipment
  • Plasma Etching Equipment

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CCP plasma etching device 'CCP-T60M/B2M'

High-precision and high-reliability oxide film microfabrication! Selectively generating radicals from process gases.

The "CCP-T60M/B2M" is a parallel plate etching device that achieves high precision and high reliability in oxide film microfabrication. It selectively generates radicals from process gases and applies 60MHz power to the upper electrode to obtain low electron temperature and high-density plasma. Additionally, it is equipped with a sequence program that constantly maintains appropriate etching process conditions. 【Features】 ■ Parallel plate etching device ■ Achieves high precision and high reliability in oxide film microfabrication ■ Selectively generates radicals from process gases ■ Applies 60MHz power to the upper electrode ■ Equipped with a sequence program *For more details, please refer to the PDF materials or feel free to contact us.

  • Etching Equipment
  • Plasma Etching Equipment

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Wire and tube etching device

Processing that is stronger than UV treatment but weaker than blasting or polishing is possible. It is suitable for processing elongated workpieces, compact, and has low running costs.

- Can process workpieces with weak mechanical strength - Non-contact treatment that does not damage the workpiece - Does not use liquids - Can process not only metals but also resins - Only Ar gas and water are required for the process - Does not produce dust or waste - Can be installed in clean rooms (excluding vacuum pumps)

  • Other processing machines
  • Plasma Etching Equipment

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Single-wafer plasma etching device "EXAM-Σ"

Carefully responding to niche demands. Light etching and ashing for thin wafers and double-sided processing, compact type CtC etching equipment.

A plasma etching device that realizes automatic sheet transport of thin wafers (100μm or less). It supports a wide range of processes with multi-mode plasma and step processes, from natural oxide film removal to thick film resist ashing, cleaning, and descumming. It is actively used in mass production environments for various devices such as discrete ICs, power devices, compound semiconductors, and MEMS, employing diverse processes.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment
  • Plasma Etching Equipment

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HCD type high-density plasma etching device

Achieving high-density plasma with a simple mechanism. Compatible with substrates from wafers to 1 m². Damage-free etching of Si-based materials, metals, organic films, and various thin films.

Achieves a plasma density that is an order of magnitude higher compared to conventional capacitively coupled plasma etching devices. High-precision etching is possible solely through innovations in the electrode structure, without using high-frequency antennas or magnets. It also has high hardware compatibility with conventional etching devices (CCP type and ICP type), contributing to low cost, high reliability, and operational efficiency. Capable of etching not only wafer-level substrates but also large substrates. A new type of high-density plasma etching device that can smoothly accommodate the increase in substrate size.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment
  • Plasma Etching Equipment

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Large plasma etching device

Batch-type etching equipment with extensive experience in etching and ashing of wafers, glass, and large substrates. Also compatible with semiconductor manufacturing equipment parts and materials.

Based on the highly successful batch-type plasma etching system "EXAM," the stage has been expanded to accommodate a maximum diameter of 600 mm or 500 mm square. The large stage supports a wide range of processes, including fine-pitch etching, ashing of various organic materials, surface modification, and cleaning. Similar to the conventional model EXAM, it performs etching on wafers, glass, and ceramic substrates, and has extensive experience in etching, cleaning, and surface treatment of large mounted substrates and pre-cut film substrates. This new dry process tool is also optimal for processing large products that require cleanliness and delicate surface treatment, such as semiconductor manufacturing equipment parts and materials, in addition to electronic devices.

  • Etching Equipment
  • Plasma surface treatment equipment
  • Plasma Etching Equipment

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Sanyu Manufacturing Co., Ltd. Company Profile

With cultivated skills and a new sensibility, we will continue to advance into the new era!

Sanyu Manufacturing Co., Ltd. is a manufacturing company that produces medical analytical instruments, accessories related to electron microscopes, and tools for semiconductor failure analysis. Since its establishment, the company has focused on precision machining, and the technology cultivated there has shaped our technical foundation. By maintaining a consistent production system from design, machining, to assembly and adjustment, we are able to respond to customers' demands for short delivery times. Currently, the majority of our production is related to medical analytical instruments, but in recent years, we have also been engaged in technology development aimed at the next generation. We aim to anticipate our customers' needs and continuously act as challengers, contributing to the advancement of science and the creation of the future. 【Business Activities】 ■ Manufacturing of accessories related to electron microscopes ■ Manufacturing of semiconductor failure analysis tools ■ Precision machining ■ Manufacturing of analytical instrument-related products *For more details, please download the PDF or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Contract manufacturing
  • Plasma Etching Equipment

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Batch-type compound semiconductor mass production machine plasma CVD and plasma etching equipment.

The industry's smallest, designed and manufactured in France, compatible with 2 to 12-inch wafers by simply replacing the wafer tray, Corial 300 and 500 series.

We would like to introduce our thin film PECVD and dry etching equipment, the "SHUTTLELINE(R)" and the compact 300 & 500 series compatible with batch processes. Film deposition is done using PECVD, while etching is performed using RIE, ICP, and ICP-RIE. By utilizing a unique wafer stage, it is possible to batch process from 1 to a maximum of 27 pieces for 2-inch wafers, for example. These systems can be used from development to mass production. 【Features】 ■ The PECVD deposition equipment features a compact chamber design and incorporates automatic cleaning, maximizing throughput. ■ The etching equipment is said to reduce operational costs, making it popular among many micro LED manufacturers. ■ It accommodates various wafer sizes and shapes, including wafer pieces and full wafers, and thanks to the shuttle system (wafer stage), no hardware changes are needed for different sample sizes. *For more details, please feel free to contact us.

  • Etching Equipment
  • Plasma Etching Equipment

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High-Density Radical Cleaning Solution

Generates 50 to 100 times more radicals compared to similar technologies from other companies, providing a damage-free process!

The high-density radical cleaning process can completely remove residues such as photoresist and polymers without damaging delicate devices or complex structures. Furthermore, for fine structures such as medical implants, our unique plasma source using remote plasma allows for the removal of residues that could not be completely eliminated by wet processes. Additionally, processing can be performed at both high and low temperatures for complex shapes using high-density radical flux. 【Features】 ■ Flexible processing over a wide temperature range ■ High selectivity and uniformity in the process ■ Capability to completely clean samples with complex shapes *For more details, please feel free to contact us.

  • Other contract services
  • Plasma Etching Equipment

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Cu etching compatible high-density plasma etching device

Equipped with a new plasma source HCD (hollow cathode discharge) electrode, capable of etching various metals and Cu thin films. A new type of etching device that also facilitates large-area processing.

Equipped with a newly developed plasma source HCd (hollow cathode discharge) type electrode. Achieves a plasma density that is an order of magnitude higher than conventional electrodes with a simple k structure that is free of magnetic fields and antennas. Supports etching of not only various metals but also difficult-to-etch materials such as Cu thin films with uniquely developed high-density plasma and proprietary processes. The newly developed HCD type head allows for easy scale-up and enables high-precision etching of rectangular substrates and large substrates. Supports metal etching of 300 mm wafers, stacked substrates, and substrates up to 1 m². A new type of etching device that covers semiconductor peripheral materials (photo masks, high-density mounting substrates) that have seen increasing demand in recent years, breaking away from conventional plasma etching methods.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment
  • Plasma Etching Equipment

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